Substrate levelling belt

Controlled stock removal on base material.

Enclosed surface finishing line, general consumables category reference — General reference illustration — not a photograph of a specific part number or product, and not plant documentation. Dimensions, not images, define a specification.

Grit / size: Custom sizes; 400# 600# 800# 1000#
Process stream: PCB process finishing
Supply: Made to line

Where it is used

Base and copper-clad laminate levelling, flash removal, plugging-compound grinding, press-plate and carrier conditioning, high-gloss and IC substrate polishing.

Product characteristics

Controlled stock removal on base material.

Configuration. Width, core, bond and grit are set to the machine and the board or workpiece. Send the machine model and the defect you want removed; we will come back with a grit sequence and a sample plan rather than a catalogue price.

Ask for a grit sequence.

One line description is enough to start.

Request a quote

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