For process engineers
Match the grit to the defect, not the habit.
PCB process finishing
8 product families, with the grit ladder and the process step each one belongs to. Sizes and bonds are configured per line.
Ceramic abrasive rollW100 mm x L91.4 m; 240# 320# 400# 600#Roughening after pressing, deburring after drilling, thick-copper levelling, oxidation prevention, surface prep before solder mask.Finishing abrasive rollW100 mm x L91.4 m; 400# 600# 800# 1000#Cleaning and levelling electroplated copper, removing residual ink oxide, copper cleaning before flying-probe test, flexible-board finishing and polishing.Endless abrasive beltCustom sizes; 400# 600# 800# 1000#Grinding after resin plugging, inner-layer black/brown oxide treatment, burn reduction and copper levelling, deburring after routing and V-CUT.Substrate levelling beltCustom sizes; 400# 600# 800# 1000#Base and copper-clad laminate levelling, flash removal, plugging-compound grinding, press-plate and carrier conditioning, high-gloss and IC substrate polishing.Ceramic abrasive brush rollerCustom size; 240# 320# 400# 600# 800# 1000# 1200# 1500# 2000# 3000#Removing resin overflow after plugging, levelling resin in blind / IVH / BVH builds, post-plating surface treatment, inner-layer and pre-press surface grinding, high-end laminates.HD high-density brush rollerCustom size; 320# 400# 600# 800# 1000# 1200# 1500#Deburring after mechanical and laser drilling, cleaning before dry film and solder mask, removing plugging ink, cleaning stainless-steel press plates.HC high-cut brush rollerCustom size; 320# 400# 600# 800#Removing copper particles and nodules after plating, removing excess plugging resin, brown-oxide conditioning, cleaning stainless-steel press plates.Press plate cleaning brush180# 240# 320#Roughening before solder mask and dry film, pretreatment, high-efficiency cleaning of stainless-steel press plates.